Two process for a solderable final finish.
- Chemical Tin
- Chemical Silver

Chemical tin process UNISTAN
 Process UNISTAN guaranteed solderability during 6 months, it gives a dense and fine grain tin deposit.  Thickness of tin layer between 0.8 and 1.2 µm.

UNISTAN has an excellent resistance to oxydation, which allows him multiple passages in REFLOW and soldering wave.

With UNISTAN the problem of the "Whiskers" is solved.

UNISTAN contains a specific inhibiting system which enables him to have a high productivity


Chemical silver process SYLVERSTAN
process SILVERSTAN guaranteed solderability during 1 year, it gives a dense and fine grain tin deposit.  Thickness of tin layer between  0.2 and 0.3 um.

process SILVERSTAN is very speed, 6 minutes cycle time .

process SILVERSTAN allows him multiple passages in REFLOW and soldering wave



UNISTAN SILVERSTAN Process make it possible to treat the printed circuits simple and double faces, multi-layer, flexible, and flex-rigid, they use in horizontal and vertical process. UNISTAN SILVERSTAN are used to treat flexible circuits with technology « reel to reel ». UNISTAN SILVERSTAN  are recommended for the circuits  « fine line » et « micro fine-line ».