N T S propose two products of goods adapted to Micro etching surface of copper, according to the steps of manufacture of the printed circuit.

Or purpose can be resumed in a few essential points :
	Better dry film and photo-imageable adhesion
	Stability and uniformity of the micro-etching
	Reduce the financial costs
	Easy use in the existing equipment

Dry film inners and externals layers
The high definition circuit boards, with fine line down to 100 microns even 40 microns, don’t admit the traditional methods for the adhesion of dry film or photo-imageable mask.

For this reason the mechanical processes, scrub, persulfates etc… are limited.


NTS formulated ETCHBRITE to solve this problem, a sulphuric acid and stabilised hydro peroxide product

Ask more informations about NTS515  ( contact )

Dry film inners and externals layers and soldermask
Micro-Etch Adherence promoter

NTS 535 is designed to eliminate problems of adherence of soldermask, especially when finishing surfaces such as nickel/gold and immersion tin are used.

Ask more informations about NTS535 ( contact )